IPC Seminar Day 1 in English

Block 1 09:00-11:00 (Including one coffee break)

What quality and reliability problems occur in PCB?

• Survey of different types of hardware problems, which can occur in the production chain of a PCB’s for electronic products.

• What risks are involved with a Lead Free process?

 

• What costs are involved with quality and reliability problems?

Requirements for the electronic designers and CAD operators.

• What project leaders, product owners and electronic designers need to know before they start to develop a new electronic product.

• IPC Class 1, 2 or 3, Level A, B or C?

• Material Declaration?

• Basic Data and Specifications in CAD design for the electronic designer?

• Which tasks and responsibilities do CAD operators require?

• Mechanical tolerances for bare boards?

• Basic Data and Specifications provided by the CAD operator for the bare board manufacture.

• IPC-2221B, IPC-2222A and IPC-7351B will be discussed plus others relevant IPC standards for electronic design and CAD.

 

Block 2 11:00-12:00

Principals of Bare Board manufacturing.

• What does a Bare Board cost?

• Which standard and special base material exists for Bare Boards today?

• Environmental aspects for base material choices?

• Which different thicknesses of Cu and dielectric can a bare board consists of?

• What effect has RoHS had on material properties Tg, Td, Dk & Df?

• CAF.

• IPC-4101D will be discussed as well as other relevant IPC standards for base materials.

 

Lunch 12:00-13:00

 

Block 3 13:00-14:00

Principals of Bare Board manufacturing (cont).

• Manufacturing of a 2-Layer bare board.

• Manufacturing of a 4-Layer bare board.

• Different surface finishes pluses and minuses

• Standards dealing in Qualifications and Acceptability of Printed Boards will be discussed. IPC-6011, IPC-6012C, J-STD-003B and IPC-A-600H.

 

Block 3 14:00-15:00 (Including one coffee break)

Electronic Assembling and Soldering.

• What is a lead free process.

• Acceptability and Requirements for Electronic Assemblies will be discussed using IPC Standards; J-STD-001F, IPC-610F, IPC-7711/21B and IPC-620B.

• Comparing the cost of prototyping vs. large volume of PCBA.

 

• Comparing cost of scrapping vs. repairing (Real world examples are provided).

 

Block 4 15:00-16:00

Discussion on Cleaning and Conformal Coating.

• Why Cleaning, Measuring and Lacking?

• Is Clean Really Clean?

• Cleaning requirements?

• Different methods of cleaning PCBAs?

 

Checklist Requirements

• Why is a Checklist useful in the production chain of a PCBA’s?

• How many parameters are there?

• Before orders are sent out, what parameters do Project leaders, CAD operators and

the Purchasing department control?

• Which IPC Standards should I use?

 

One copy of the IPC Checklist will be provided to each attendee.

 

IPC Seminar Day 2 in English

 

Meeting IPC Class 3 Production

 

Block 1 09:00-11:30 (Including one coffee break)

Being able to design and produce large quantities of high-tech PCBs according to IPC Class 3 requirements, involves control over many production factors. Knowledge of over 70 IPC Standards is critical to meeting IPC Class 3 requirements. The combination of these two factors is demanding but ultimately can lead to a high return on investment. This workshop will provide attendees the tools to meet the IPC Class 3 requirements for both external and internal production yield goals.

 

Demands for producing IPC Class 3 through the entire electronic supply chain.

 

The Workshop will cover the following areas:

• What do Project Leaders and Electronic Designers need to specify in order to meet the demands for IPC Class 3?

• IPC standards you would use are presented and explained.

• What is required from the CAD department in order to manufacture bare boards that meet IPC Class 3?

• IPC standards you would use are presented and explained.

• How can the purchasing department secure bare boards that meet IPC Class 3 requirements?

• IPC standards you would use are presented and explained.

• How can the assembly and soldering departments know they are meeting the demands of IPC Class 3 requirements?

 

• IPC standards you would use are presented and explained.

 

IPC Troubleshooting

 

Block 2 11:30-14:30 (Including lunch 12:00-13:00)

In this workshop, we will study two real cases. Using various methods to analyze the problem, we will recommend solutions to ensure the problem will not reoccur.

 

My Solder Joints Are Not Perfect, Why?

 

Methods for Analyzing Solder Joint Problems, With Recommendations to Solve the Problems

This Workshop will cover two case studies, using IPC Class 3 requirements for solder joints. In these cases, bad solder joints can be hard to find! These case studies will help answer your questions on class 3 requirements, root causes and the identified costs.

 

Case Study 1:

• The solder doesn’t fill the plated through holes in order to meet the IPC Standard for Class 3 requirements.

• What is the Root Cause or Causes?

• What is the cost? 

Case number 2:

• Tomb Stoning of 0402 components, is a defect according to IPC Class 3 requirements.

• What is the Root Cause or Causes?

• What can such a problem cost?

 

Coffee Break: 15:00-15:15

 

Block 3 15:15-15:45

Summary, Questions and Adjourned

 

REGISTRATION:

By e-mail to ipc@tptlive.ee 

The number of places is limited so please register as soon as possible.