09:30-10:00 Registration & Coffee

10:00-10:20 Welcome and introduction

Ahti Kuningas, Secretary General, Ministry of Economic Affairs and Communications of Republic of Estonia

Otto Pukk, Chairman of the Council, the Estonian Electronics Industries Association, President and CEO, Incap Corporation

Philippe Leonard, Senior Director, IPC

10:20-11:05 State of the industry

Dieter Weiss, CEO, In4ma

Michael Kuensebeck, Owner, Kuensebeck Consulting

11:05-11:25 Electronics Industry in Estonia

Arno Kolk, Managing Director, the Estonian Electronics Industries Association

11:25-11:45 Advanced Packaging

Peter Tranitz, Senior Director, IPC

Alison James, Senior Director Government Relations, Europe

12:00-13:00 Lunch & Expo

13:00-13:30 Beyond PCBA: Hybrid solutions

Riwan Tamic, CEO, C-MAC

13:30-14:00 Crisis? What crisis?

Otto Pukk, Chairman of the Council, the Estonian Electronics Industries Association, President and CEO, Incap Corporation

14:00-14:30 Zollner Elektronik AG: vertical integration and beyond

Manfred Amberger, SVP Sales, Zollner

14:40-15:10 Coffee & Expo

15:10-15:40 Increasing labor efficiency on your SMT shopfloor

Haithem Jeridi, ASMPT

15:40-16:10 Innovative SaaS solutions for today’s electronics industry

Denis Lobzov, Business Development Manager, Siemens EDA

16:10-17:00 Distributors’ panel

Felix Corbett, Director Supplier Marketing Europe Passives & Discretes, TTI
Christian Brusdal, Sales Director, Nordics, Arrow
Ronnie Roos, Regional Sales Manager, Avnet

17:00-19:00 Reception & Cocktails

The moderator of the seminar is CEO and Co-Founder of Olev Tehver.


Special room rate is available for the seminar guests at the Radisson Blu hotel Olümpia.
Please use the link below when booking your room.


Arno Kolk is the Managing Director of the Estonian Electronics Industries Association. He has extensive experience in the electronics sector – he started his career as an R&D engineer in Tallinn University of Technology (TalTech) and worked in different engineering and management positions in EMS and engineering companies in several countries.

In his presentation, Arno Kolk will give you an overview of how Estonia’s world-class electronics industry is embracing modern practices and why this small and agile country is uniquely positioned to be the perfect test site for new products and processes.

Dieter G. Weiss is the head behind in4ma, the most reliable data source for the European EMS Industry. He has 42 years of experience in the electronics industry and has been studying the European EMS industry for many years – developing a database of more than 2150 EMS companies in Europe. The database provides a lot of detailed information which is regularly updated and fed with actual data in order to study actual market developments.

Riwan Tamic has been appointed CEO of C-MAC by July 2022 and has tken the challenge to manage the countinuous growth of the company and explore new opportunities. Riwan has more than 25 years of Electronics Industry experience, including 20 years at world-leading, Electronics Manufacturing Services provider, JABIL, leading several Businesses for brand company leaders. In addition to his EMS industry experience, Riwan has held multiple management roles in different areas such as Quality, Supply Chain, Operations and Business management, in several industry sectors, including the Automotive sector.

Christian Brusdal has a long experience in the electronic business and during his 24 years career in Arrow, he mostly worked as Technical Sales Manager and over the last few years in position as General Manager of Arrow Norway. He also has experience from the IT & Cyber Security industry as Chief Sales Officer before he took over the role in Arrow as Sales Director for Nordic and Baltics.

Michael Künsebeck began his professional career after training as a wholesale and businessman in the area of national and international purchasing at an industrial company. This was followed by his first station in sales at a trading company. 

From 2004 to 2007, he successfully completed a degree in business administration with a focus on controlling, logistics and marketing at the Osnabrück University of Applied Sciences. After his studies, several career steps followed at a leading South German manufacturer in the security technology sector. 

Here he gained extensive experience in the areas of process knowledge, organizational development, project management, change management and the development of electronic products. In 2014, he took over the management of the EMS Sales business unit at a large German electronics manufacturer. In the following 7 years, he was able to successfully expand this and significantly increase awareness in the market.

Today, Michael Künsebeck lives with his wife and 3 children back in his original home in North Rhine Westphalia, Germany. In 2022 he founded künsebeck e² consulting and joined a partner network with matthias holsten e² consulting GmbH and in4ma.

Otto Richard Pukk is the President and CEO of Incap Corporation and Chairman of the Council of the Estonian Electronics Industries Association. He has served in demanding positions in various technology companies, thereby gaining comprehensive experience in managing and leading operations of international companies. Before joining international electronics manufacturer Incap he served as the CEO in Enefit Technology Industries and held different managerial positions in ETAL Group – in Baltic countries, Finland and Asia.

Manfred Amberger is Senior Vice President Marketing & Sales of Zollner Elektronik AG, Zandt/Germany. He joined the Zollner Group more than 35 years ago and held different positions as Unit Leader, Head of Key Account Management, Managing Director and SVP Marketing & Sales. During his career he spent several years in eastern Europe as well as in Switzerland where he built up the Swiss location for the Zollner group. With more than 35 years experience in the global EMS industry he has deep knowledge in regards of current and future EMS and market requirements.

Alison James is IPC’s Senior Director for European Government Relations. She is responsible for European advocacy and public policy, representing IPC and the electronics industry towards the EU Institutions and policymakers in Europe.

Alison has over 25 years experience in European Public Affairs across technology, manufacturing and media sectors. She began her career with the European Commission and subsequently led the European public affairs functions for a variety of multinationals and Trade Associations including Kodak and the Hollywood studios.

Haithem Jeridi is Factory Solution Manager at ASMPT.

After obtaining his university degree in mechatronics and automation technology, Haithem Jeridi joined ASM SMT Solutions in 2015 as a system test engineer in the R & D department. In 2017, he made the change to ASMPT’s Product Marketing team in the position of a Factory Solution Manager. Haithem Jeridi is both familiar with deep technological and developmental aspects of electronics manufacturing and ASMPT’s solutions as well as with the way these solutions operate in the field. In his position, he frequently visits and consults electronics manufacturers with his specific field of expertise being system integration and material management, has successfully supported numerous implementation projects and is familiar with typical challenges and benefits.

Peter Tranitz is Senior Director Technology Solutions at IPC.

Peter is a PhD in Physics. During his postdoc time in Cincinnati and Regensburg and his short assignment at Infineon in Dresden, he gained experience in semiconductor manufacturing and characterization. The last 18 years, Peter worked at Continental Automotive as Principal Expert and department head for the development and standardization of electro-mechanical manufacturing technologies. During his academia and industry assignments he published more then 70 papers and issued several patents.

Just recently, Peter joined the newly installed IPC Electronics Europe GmbH in Munich as Senior Director Technology Solutions. In this function he participated already at the IEEE Electronic System-Integration Technology Conference in Sibiu and the IPC – Advanced Packaging Symposium in Washington, DC.


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