The Estonian Chip Center took part in the Annual General Meeting of the Estonian Electronics Industries Association (EETL), where it showcased how Estonian electronics companies can benefit from the Chip Center’s expertise, European partnerships and technical capabilities.
Mohammad Eslami, Senior Physical Design Engineer, gave an overview of the support available to companies developing chip-based products and application-specific integrated circuits (ASICs). He explained how businesses can access chip design expertise, design infrastructure, pilot lines, training and international collaboration through the Chip Center.
A key part of the presentation focused on the European pilot lines established under the Chips Joint Undertaking. Through the Chip Center, Estonian companies can explore pilot manufacturing and technology development opportunities in areas such as advanced CMOS technologies, heterogeneous integration and packaging, wide-bandgap semiconductors, and photonic integrated circuits. These facilities allow companies to prototype, validate new technologies and prepare for industrial production.
Mohammad also described how the Chip Center supports companies throughout the semiconductor development process, from early-stage chip architecture and design to functional verification, pilot production and manufacturing readiness.
In addition to technical expertise, KIIP offers training, workshops and access to a broad European network of semiconductor experts and organisations, helping companies build new capabilities and strengthen their innovation activities.