European ESD Factory Symposium

September 12 –14, 2023

Park Inn by Radisson Meriton Conference & Spa Hotel Tallinn, Estonia



9:00- 17:00

How to set up an ESD Control Plan

Reinhold Gaertner, Infineon Technologies; Wolfgang Stadler; Intel; Toni Viheriakoski, Cascade Metrology

Goal of an ESD Control Plan; Basics; Standards; Administrative requirements; Technical requirements incl. measurements for qualification; Packing materials for Transport and storage; How to set up an ESD Protected Area (EPA)


9:00- 12:00

Compliance Verification incl. Measurement techniques

Reinhold Gaertner, Infineon Technologies; Wolfgang Stadler; Intel; Toni Viheriakoski, Cascade Metrology

Goal of a Verification Plan; Standards; Technical requirements incl. measurements for verification; documentation


13:00 – 13:15

Welcome and Opening
Reinhold Gaertner – Infineon Technologies

Session 1

13:15- 13:45

Inherently dissipative polymer (IDP) additives – Design for Innovative Static Control
Tapio Hietaranta, Cargill

This presentation shows a 5-step guide to designing permanent anti-static products, for example packaging used to protect ESD sensitive devices. The first step is to identify the polymer type, plastic product processing method, and end application. Within supplied technical specifications, electrostatic performance is the most important factor to determine. However, other important properties the material must fulfil such as transparency, mechanical properties or cost target should not be compromised. After the required information is collected, we can propose right Ionphase product with optimal let-down ratio. The last topic will discuss innovative IDP applications for electronics packaging and healthcare industries.”

13:45- 14:15

Ionization Basics
Joshua Yoo, Core Insight

ESD control strategy, ionization technology overview, evaluation measurement and application guideline as CDM ESD control solution. Presentation and DEMO video will explain what ionization effectiveness and limitations are.

14:15- 14:45

Electric Field Control Methodology to Support VDA EIPD Level 2 Investigations
Tibor Toth, NXP, Hungary

The presentation provides an overview about how the VDA EOS in the Automotive Industry guideline was adopted by NXP. The rollout started on 1st July 2020. NXP’s customer quality complaint handling flow was reworked to include the scenarios for EIPD Level 1 and Level 2 failures. Automatic Data Analysis and Risk Assessment Tools were implemented to enable the risk assessment according to the VDA process. For EIPD Level 2 investigations, NXP has built up a framework to support the systematic root cause identification. This includes EIPD Root Cause Fault Tree Analysis, Process Event Driven risk areas, Checklists, Guidelines, Electrical Field Control (EFC) Assessments at customers. The EFC assessment is a service provided for customers by NXP’s quality organization typically for TIER1s but also for OEMs manufacturing lines. They help to build partnership during the investigations between OEM, PCBA, IC to reduce EOS failures as fast as possible by implementing EFC as standard practice. EFC prevents PCBA and Cable discharge events which are considered as most common causes of IC damage. The presentation will cover the techniques and equipment applied during the EFC assessments and will provide examples of findings from real customer assessments.

14:45- 15:30

Break and Exhibition

Session 2

15:30- 16:00

Practical Demonstrations – Measurements of electrostatic fields and surface potentials
Reinhold Gaertner, Infineon Technologies

16:00- 16:30

In-situ discharge current sensing in a pick and place machine
Ellen Jirutkova, EMFT Fraunhofer

Nowadays, a trend towards Multi-Chip Modules (MCM) and Systems in a Package (SiP) is observable in the semiconductor industry. During the assembly of the MCMs, the components may be exposed to ESD stress caused by handling. This talk presents in-situ measurements of discharge currents with a test setup which can occur in a pick and place machine. The talk covers the design of the test setup and presents measurements in a laboratory environment using a simple pick and place vacuum head and in-situ measurements in a state-of-the-art pick and place machine.

16:30- 17:00

Using discharge current measurements in risk assessment
István Kovalik, Harman Becker

ANSI/ESD SP17.1 document gives us a very good guidance for evaluating our manufacturing processes to determine if there are any ESD risks. Capturing the actual discharge waveform is the recommended best method because it could be compared with qualification waveforms come from ESD sensitivity test results of the devices. This presentation shows how I started performing discharge current measurements to answer some risk assessment questions, and it shows also how answers could generate other questions during the progress.

17:00- 18:00

Break and Exhibition with Fingerfood

18:00- 20:00

Panel Discussion – Risk Assessment

Session 3

8:30- 9:00

ESD failures at production line and preventive actions
Matti Uusimäki, Radientum Oy

Three short stories of ESD failures in production line is discussed. All of the cases were causing manufacturing yield drops in mass production phase until failure source was fixed. The found root causes and corrective actions are introduced with stories and lessons from the analysis. Some of these lessons has additional spice from the stories of similar phenomenon seen in products’ ESD R&D or approval testing phase.

9:00- 9:30

In situ measuring devices to detect critical electrostatic charges at wafer level and on photomasks
Thomas Sebald, Estion Technologies

Critical electrostatic charges on wafers and photomasks in front-end semiconductor production tools cannot be measured with conventional hand-held measuring devices. Measuring systems are presented that can analyze electrostatic charges at wafer level and on photomasks in wafer fabs or during mask production in situ in the process systems. “Real-life” examples of such measurements are explained. Based on these measurements and statements from users, the limit values for ESD risks are discussed depending on the “technology node” in SEMI standards, the ITRS and other guidelines.

9:30- 10:00

CPM Test Limitation Study for AC, Pulsed AC and High Frequency AC Ionizers vs. DC based Ionizers
Joshua Yoo, Core Insight

There are some technical limitations with current charge plate monitor (CPM) technology for voltage switching type of ionizers such as AC, pulsed AC and high frequency AC ionizers. Technical limitations are mainly related with lack of response speed of CPM and other simpler portable ionizer testing instruments. ANSI/ESD S20.20 and IEC 61340-5-1 standards requires offset value should be less than 35 volts. Most of CPM manufacturer provides average and peak values instead offset value. Current CPM technology has very limited to analysis of AC ionizers and it’s induction field risk.

10:00- 10:45

Break and Exhibition

Session 4

10:45- 11:15

Practical Demonstrations – How to check ionizers
Joshua Yoo, Core Insight

ESD control strategy, ionization technology overview, evaluation measurement and application guideline as CDM ESD control solution. Presentation and DEMO video will explain what ionization effectiveness and limitations are.

11:15- 11:45

Die-to-Die ESD Discharge Current Analysis
Pasi Tamminen, Danfoss

SoC can contain multiple silicon dies connected by die-to-die interfaces. These interfaces do not require excessive on-chip ESD protection but must survive through frontend and backend processes. In this study die-to-die discharge current waveforms are analyzed with calculation and measurement methods to estimate ESD protection targets for the internal interfaces

11:45- 12:15

Are ESD chairs good enough for grounding personnel?
Reinhold Gaertner, Infineon Technologies

In this paper, different non-powered hand tools such as tweezers, pliers, or screwdrivers are assessed with respect to their ESD risk. The ESD properties of the tools are evaluated using resistance measurements and discharge current measurements between the tool and devices. Acceptance tests for non-powered hand-tools are proposed.

12:15- 13:15


Session 5

13:15- 13:45

Practical Demonstrations – Resistance Measurements
Toni Viheriakoski, Cascade Metrology

13:45- 14:15

ESD flooring system – operation, testing, standards
Olivier Thill, Gerflor

Flooring is a key part of the solution to control the quality of an ESD production environment. In addition to its primary flooring functions, it allows the control of the level of electrostatic charges in a workshop to protect electronic parts or devices from discharge.

The objective of this presentation is to explain:

  • the operation of the system of which the floor covering forms part to allow the flow of electrostatic charges to the protective earth
  • methods of carrying out ESD measurements to characterize the effectiveness of the flooring
  • specifications and standards that categorize floorings according to their level of performance

14:15- 14:45

ESD Risk Assessment in Production Environments Based on Discharge Sensing with Antennas
Lena Zeitlhoefler, Infineon Technologies

A methodology for ESD risk assessment is described in which discharges of semiconductor products are localized by the use of antennas. The shape and amplitude of the sensed antenna signal in the running process are correlated to manually provoked ESD events by specially designed discharge electrodes. The discharge current and its corresponding antenna signal are compared for different tools and antennas to demonstrate the dynamic range and sensitivity of the methodology.

14:45- 15:30

Break and Exhibition

Session 6

15:15- 15:45

New possibility for field measurements at EPA entrance checks
Christian Hinz, StatX Deutschland

The entrance checks for EPAs are in the moment based on a semi-complete information. Only the resistance of the shoe is tested in combination with the person standing on a metal plate. With this method, not only the third part of the system is missing. The floor has a major impact on the functionality of the combined person/shoe/flooring system as the main grounding system for workers inside the EPA. Another big issue is the import of charged materials into the EPA. 95 to 99% of today’s ESD failures are related to CDM events and thus often to electrostatic fields. How do these fields affect the stability of the production process? How do these fields affect the stability of the production process? To improve the reliability of the ESD system, a new type of entrance checker could be used. Based on a field strength measurement, real time information is given about the grounding status of the objects or persons passing the measured area. Charged materials and bad combinations of shoes and flooring systems could be recognized immediately

15:45- 16:15

Characterizing requirements of different EPA flooring systems
Tero Tasa, Armeka

Requirement engineering is mandatory part of the flooring system installation process to ensure build and implement good flooring system. Requirement specification is a mandatory part of the flooring application to ensure that the application meets the most relevant customer requirements. By evaluating and levelling the requirements there is always room for optimization without compromises. The user and the process including long term maintenance are the key features for the application. Multilayer applications which are built and installed in place from the functional components can be adjusted and tuned based on ESD requirements and other standardized requirements but also usability and durability requirements.

16:15- 16:45

Electrostatic Control in Healthcare
Toni Viheriakoski, Cascade Metrology

The increasing use of synthetic materials in hospitals has led to various hazards caused by static electricity, such as fire, equipment damage, infections and electrostatic shock to patients and staff. This presentation will show these risks through real-life cases and provide practical measures to minimize their impact. Additionally, the most crucial international requirements and recommendations for hospital safety from electrostatic control point of view will be discussed.

16:45- 17:00

Wrap up and Closing


Tapio Hietaranta from Cargill is a Sales Development Specialist for the Ionphase™ permanent anti-static additive portfolio. After graduating with Master of Science in Plastics Technology, Tapio has total 22 years of professional experience in the plastics sector, 13 of which have been in R&D, technical support, and sales for Ionphase™ permanent anti-static products. In his current daily work, Tapio solves customer’s static related issues in plastics by proposing the right product design, and processing and measuring techniques.

Joshua (Yong Hoon) Yoo is a president of Korea EOS/ESD Association and Core Insight, Inc. He was a board of director of the EOS/ESD Association, Inc. during 2016 – 2018. He is an active member of standard working groups for Process Assessment, EOS Best Practices, High Reliability, Ionization and was a chair of FPD working group. He is an expert and technical support for micro contamination and ESD issues in FPD industry with his 25+ years of experience in static control industry. He holds certification as Professional ESD Program Manager and iNarte ESD Engineer.

Electronics Technician, and Bachelor degree in Light Industry and Environmental Engineering of Óbuda University (Budapest) in 2001. Started career as Customer Quality Engineer at Samsung in Hungary,.Joined Philips Semiconductors in 2006 as Field Quality Engineer, which became NXP Semiconductors in 2007.

Currently leading the quality complaint handling team in Budapest and at the same time focusing on EOS/EIPD topics. Since 2017, I work as Electric Field control expert supporting NXP’s customers in root cause identification and manufacturing line assessments

Ellen Jirutková joined the Analysis & Test group at Fraunhofer EMFT in 2018 and has been supporting the team in researching topics related to electrostatic discharges. She received her Bachelor (2018) and Master degree (2021) at the Technical University of Munich (TUM), Germany. Since then, she has been working as research associate at Fraunhofer EMFT, specializing on ESD test methods, ESD robustness and protection and simulations. In 2022, she started to work on her PhD with the focus on ESD risks in Multi-Chip Modules (MCM) and Systems in Package (SiP). Ellen is an active member of the ESD Association and joined the steering committee of the International ESD Workshop 2023 in Tutzing, Germany.

Istvan Kovalik began his work in the field of ESD control in 2003. He has fallen into love to this topic and started to go deeper into it. He’s been working as an ESD Coordinator at Harman for 8 years, and responsible for all aspects of ESD control in 3 facilities in his country. He performs some volunteer works for ESDA and received his ESD Program Manager Certification in 2023

Matti Uusimäki, MSc, has 30 years of experience in electronics designing and has been involved in EMC, EMI and ESD design since 1995. He was leading EMC design competence globally at Nokia Mobile Phones over 10 years. During this time, he developed the 3D EMC simulations methodology and module level testing methods for EMC. Matti has been a field application engineer for Semtech analog ICs and worked with Ansys simulation tools in EDR&Medeso. At this moment he is a consultant at Radientum Oy that is an antenna, EMC and RF design, simulation and testing service company.

Thomas Sebald, born 1956, studied Physics and Chemistry at the Technical University of Berlin. He developed ionization systems for high-end cleanrooms for the semiconductor industry. Since 1990 he runs his consulting business for cleanroom technology and static control with world-wide customers mainly from the semiconductor and electronics industry. In the past years his company ESTION Technologies developed and sells in-situ measuring devices to analyze electrostatic conditions in production machines under real-life conditions.

Reinhold Gaertner received his diploma in physics from the Technical University of Munich in 1987. Then he joined the Federal Armed Forces University Munich, where he was working on measurement techniques for ESD protective packaging materials. After working as an independent ESD consultant, he joined Siemens Semiconductors in 1996; which is now Infineon Technologies. As Distinguished Engineer for ESD protection he is responsible for all problems regarding external ESD protection at Infineon worldwide and also for problems in customer production, as well as for ESD device testing for qualification. Since 1989, he has lectured on static control and since 1991, he has been an active member of the German ESD Association, where he has been acting as vice president for the last couple of years. Since 1995, he has worked in the ESD standardization of IEC TC101 Electrostatics, where he is currently convenor of the working group “Protection of electronic devices against static electricity”. In 2009, he received the outstanding contribution award of the ESDA and between 2011 and 2019 he was part of the ESDA board of directors.

Pasi received the M.Sc degree in Electronics Engineering from Oulu University, Finland in 1997 and continued to work in NOKIA Networks with automated production technologies, testing, machine vision, process control and design for manufacturability. In 2001-2005 he was at VTT Technical Research Centre of Finland and worked with risk management, EMC/ESD and cleanroom control methods. Between 2005 and 2012 Pasi worked worked as the global process owner of ESD and cleanroom control at NOKIA Mobile Phones. Between 2014 and 2015 he worked in Microsoft R&D on product EMC designs. Between 2017-2021 Pasi worked in EDR&Medeso with electromagnetics simulations and business development. In parallel, Pasi has worked with IEC and ANSI standardization bodies since 2006, done research on electrostatics, antennas, RF, EMC/ESD failures, component and system EMC/ESD/RF qualification, and control methods. He joined Tampere University of Technology 2012 and received a degree Doctor of Science and Technology in January 2017. Currently, he is working at Danfoss Drives on system level EMC.

Olivier Thill is a graduate of CNAM Lyon, in plastics processing. In Gerflor’s R&D department, he has been in charge of developing the technical ranges of ESD flooring for more than 20 years.

A methodology for ESD risk assessment is described in which discharges of semiconductor products are localized by the use of antennas. The shape and amplitude of the sensed antenna signal in the running process are correlated to manually provoked ESD events by specially designed discharge electrodes. The discharge current and its corresponding antenna signal are compared for different tools and antennas to demonstrate the dynamic range and sensitivity of the methodology.

Christian Hinz has over 20 years of experience in ESD-protection. Since 2015 he is head of the ISO 9001 certified Stat-X ESD Centre of competence. He is responsible for audits, training and establishing ESD-control- programs as an external ESD-coordinator. In 2016 he has Successfully completed a course to become a quality management officer. Christian Hinz is member of the German national and international standardization committee (DKE/K185 and IEC/TC101) for electrostatics. He is also an active member of interest groups like ESDA and ESD-Forum e.V., where he has published and presented different papers regarding external ESD protection in cooperation

Tero Tasa has over 25 years of experience in the electronics industry production and supply chain development. He is an expert on Quality systems and LEAN, as well as TOC process development tools and methods. He has extensive experience with production material processes and production quality assurance. He is a Member of the Board in Finnish National Association in Co-operation for Research and Development of Electronics KOTEL R.Y.

Toni Viheriäkoski established electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. He moved on to his own company, Cascade Metrology Oy in 2008. Currently, he is working in the field of electrostatics and ESD risk analysis for healthcare, medical, electronics, automotive and process industries. Toni has written more than 30 publications related to electrostatics or ESD. He has been a chair of the Finnish STAHA Association since 2006. He was nominated a chair of the Finnish Standardization Committee SK101 in 2016. He received specialist qualification in business management in 2018. Toni received 1906 award of International Electrotechnical Commission (IEC) in 2019. He is a member of WG17 and WG25 of EOS/ESD Association and several work groups of IEC TC101. He was nominated a convenor of WG 16 of TC101 (IS 61340-6-1 and TS 61340-6.1) in 2021.

Wolfgang Stadler received his diploma degree in physics in 1991 and in 1995 the PhD degree from the Physics Department of the Technical University Munich. 1995 he joined the semiconductor division of Siemens, which became Infineon Technologies in 1999. His focus was on development of ESD-protection concepts in CMOS technologies and on innovative ESD topics. In this role he was coordinator of several European and German ESD funding projects. Since 2003 he was also responsible for the measurement characterization of I/O cells and PHYs.

2011 he joined Intel Mobile Communications which is now Intel Germany Services GmbH. Within the Corporate Quality Network, he is currently responsible for the ESD Control Program of Intel and for ESD risk assessment. Furthermore, he supports ESD/latch-up testing and qualification of products.

Wolfgang holds several patents in ESD-related topics. He is author or co-author of more than 120 technical papers and has co-authored a book on ESD simulation. He received several Best Paper Awards and gives regularly courses on ESD device testing, ESD qualification, and ESD control measures (for example, ESD Technician Certification). He is an active member of the EOS/ESD Association and IEC working groups related to ESD control and ESD process assessment. He is co-chairing the ESDA business unit “Standardization” and a member of the Standards Committee (STDCOM) and the Technical Advisory and Support Committee (TAS) of the EOS/ESD Association.  He is currently the chair of the EOS/ESD Association Working Groups“Transient Latch-up” (since 2011) and “Seating”; since 2013 he has been co-chairing the ESDA Working Group 17 “Process Assessment”. Wolfgang has been elected to serve on the Board of Directors of the EOS/ESD Association for 2014–2019 and is now appointed director. Since 2015 he is acting as the president of the German ESD FORUM e.V. In 2019, he received the Outstanding Contribution Award of the EOS/ESD Association.

Tickets and registration

10% off

for registrations before August 11

Symposium fee

attendee (does not include tutorials)


360 € including VAT

Day 1

first full day


420 € including VAT

Day 2

second half day


300 € including VAT

Days 1+2

1.5 days


660 € including VAT


A special room rate


per night
(including breakfast)

A special room rate of 65 euros per night (including breakfast) is available for the symposium guests at the Park Inn by Radisson Meriton Conference & Spa Hotel.

For a reservation with the special rate, please write an e-mail to: